TEM preparation

Nano Cleaving

Discover Perfect Cleaving technology with PCM

There are multiple requirements to produce fast perfect cleaving quality cross-section of crystalline materials. SELA delivered perfect cleave technology to semiconductor customers as from 2000 utilized in Perfect Cleave Mechanism (PCM) as complementary…

Adaptive Ion Milling – metrology solutions for V-NAND

Emerging memory technology V-NAND is one of the most challenging in terms of metrology and failure analysis. Different materials and high structures of V-NAND required special techniques to ensure fastest turnaround time for sample preparation.…

High accuracy cleaving of defect with Navigation SW on MC600i

SELA provides unique solution with SELA’s Navigation SW Option which may perform navigation to specific defect on the small piece of wafer and unlike the SEM-FIB systems which may navigate on the whole wafer only as required by other navigation…

TEM preparation

Physical Failure Analysis is a process of collecting and analyzing data to determine the cause of failure. PFA plays critical role in semiconductor industry in development of new products, optimization of process parameters and improving the…