Physical Failure Analysis is a process of collecting and analyzing data to determine the cause of failure. PFA plays critical role in semiconductor industry in development of new products, optimization of process parameters and improving the yield.
SELA offers sample preparation services for Physical Failure Analysis utilizing award winning state of the art technologies.
ADVANCED SAMPLE PREPARATION METHODS
Delayering and slope milling
Cross-section of small and big objects
Cross-section of 3D integrated structures and TSV
Cross-section of MEMS devices
SCM and SSRM preparation
Dedicated preparations for special requirements
Equipment: Xact200 SELA’s Twin Beam AIM system performs advanced sample preparation for the PFA and characterization.
For additional information about SELA products please, contact us