Physical Failure Analysis is a process of collecting and analyzing data to determine the cause of failure. PFA plays critical role in semiconductor industry in development of new products, optimization of process parameters and improving the yield.
SELA offers sample preparation services for Physical Failure Analysis utilizing award winning state of the art technologies.
SEM SAMPLE PREPARATION
Natural cleaving with high quality cross-section
Cleaving accuracy down to 100 nm
Edge cleaving- as close as 1mm (nominal) to wafer edge
Edge cleaving- as close as 0.5mm (nominal) to sample edge
Single die capability down to 2×1 mm size
Dedicated preparations for special requirements
Award winning state of the art Nano Cleaving system MC600i,
Smart Micro cleaving systems MC10, MC10i and MC20”
For additional information about SELA products please, contact us