Sela’s proprietary Dry Sawing technology is unique in its ability to provide extraction of the wafer pieces from whole wafer or die using fast precise sawing without water.
Cooling of the point of sawing and cleaning of sawed debris of wafer materials are by using controlled flow of liquid nitrogen.
Dry sawing technology advanced to avoid corrosion of materials by water and changing of physical properties of materials sensitive to water.
Dry sawing comprises unique sawing blades with special setup of sawing parameters and techniques of sawing penetration in the wafer materials and Si substrate.
Dry sawing technology utilized in the EM3i system that delivers automatic pre-preparation of the lamella with area of interest (target) for TEM and SEM cross-section and plan view TEM preparation.
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