MC600i is a fifth generation version of the award-wining Nano Cleaving series of the sample preparation systems for cross-section of crystalline materials for following SEM inspection and other analyses.
The MC600i system utilizes Nano Cleaving and Micro Cleaving technologies in two main processes – full process and fast process.
SELA’s Nano Cleaving and Micro Cleaving technologies are proved themselves as undisputed leaders for accurate, fast and artifact-free sample preparation. The MC600i system achieves fully automatic, reliable and rapid cross sectioning of wafer segments and dies. Dedicated software enables automatic mapping and navigating to targets, automatic off-loading for immediate inspection. High and consistent accuracy and excellent quality of cross-sections significantly reduce diagnostic cycle for failure analysis, characterization and process monitoring.
These features together with high throughput ensuring that sample preparation is never a bottleneck for SEM analysis.
Accuracy of full process is down to 100nm in 10 minutes
Accuracy of fast cleave is down to 3 microns in 3 minutes
Single die cleaving with dimensions down to 2x1mm
Wafer and die edge cleaving down to 0.5mm from edge
Controlled Liquid Nitrogen spraying to improve quality of cross section
Ease of use – few hours training for new operator
Automatic processing – no previous experience required
Turn-around time drastically reduced
Improves yield analysis
Improves and enhances SEM imaging
Low cost of ownership
For additional information about SELA products please, contact us