ENHANCED CAPABILITIES
- Controllable liquid nitrogen spraying during cleaving
- High quality cross-sectioning of metals, resist and other materials
- Prevention of pull out of materials during the cleaving
FEATURES
- Semi-automatic controllable cleaving process
- Accuracy better than 5 microns, mostly 2-3 microns
- Process time – single minute
- Extremally small input sample or die – down to 1×1 mm
- Cleaving as close as 1 mm to the wafer or die edge
- Continuous cleaving of multiple targets
- Advanced optics with variable magnification up to 1000x
- Software controllable cleaving process
- Built-in vacuum
- “Maintenance free” servicing model
BENEFITS
- Turnaround time significantly reduced
- Improves yield analysis
- Improves characterization
- Improves and enhances SEM and FIN utilization
- Low cost of ownership
For additional information about SELA products please, contact us