SYSTEM HIGHLIGHTS
- Perfect quality of cross-section
 - High throughput
 - Improves and enhances SEM imaging
 - Compact size
 - Low cost of ownership
 
SYSTEM FEATURES
- Perfect quality of cross-section for crystalline materials
 - Fast cleaving in less than a minute
 - Size of cleaved samples from full wafer and to single die 2x2mm
 - Manually controlled accuracy
 - Ease of use – – no previous experience required
 
For additional information about SELA products please, contact us





 