SYSTEM HIGHLIGHTS
- Perfect quality of cross-section
- High throughput
- Improves and enhances SEM imaging
- Compact size
- Low cost of ownership
SYSTEM FEATURES
- Perfect quality of cross-section for crystalline materials
- Fast cleaving in less than a minute
- Size of cleaved samples from full wafer and to single die 2x2mm
- Manually controlled accuracy
- Ease of use – – no previous experience required
For additional information about SELA products please, contact us