SYSTEM FEATURES
- Accuracy of full process is down to 100nm in 10 minutes
- Accuracy of fast cleave is down to 3 microns in 3 minutes
- Single die cleaving with dimensions down to 2x1mm
- Wafer and die edge cleaving down to 0.5mm from edge
- Controlled Liquid Nitrogen spraying to improve quality of cross section
- Ease of use – few hours training for new operator
- Automatic processing – no previous experience required
SYSTEM HIGHLIGHTS
- Turn-around time drastically reduced
- Improves yield analysis
- Improves characterization
- Improves and enhances SEM imaging
- High productivity
- Low cost of ownership
For additional information about SELA products please, contact us