SYSTEM FEATURES
- Accuracy of full process is down to 100nm in 10 minutes
 - Accuracy of fast cleave is down to 3 microns in 3 minutes
 - Single die cleaving with dimensions down to 2x1mm
 - Wafer and die edge cleaving down to 0.5mm from edge
 - Controlled Liquid Nitrogen spraying to improve quality of cross section
 - Ease of use – few hours training for new operator
 - Automatic processing – no previous experience required
 
SYSTEM HIGHLIGHTS
- Turn-around time drastically reduced
 - Improves yield analysis
 - Improves characterization
 - Improves and enhances SEM imaging
 - High productivity
 - Low cost of ownership
 
For additional information about SELA products please, contact us










 