Physical Failure Analysis is a process of collecting and analyzing data to determine the cause of failure. PFA plays critical role in semiconductor industry in development of new products, optimization of process parameters and improving the yield.
SELA offers sample preparation services for Physical Failure Analysis utilizing award winning state of the art technologies.
TEM SAMPLE PREPARATION - cross-section and plan-view
- TEM/STEM preparation of extremely small objects
- TEM/STEM preparation of big objects
- TEM/STEM preparations of powders and granules
- TEM/STEM preparation of sensitive materials
Equipment: Xact200 SELA’s Twin Beam AIM system performs advanced sample preparation for the PFA and characterization.