Solutions EnabLing nano Analysis
Language
microcleaving, cleaving, wafer cleaving, wafer cleave, MC600i

Contacts

SELA Ltd.
Headquarters
5 Hamada St
Southern High Tech Park
Yokneam Elite
2069204 Israel
+972 4 827 3988
Sela USA Inc.
473 Sapena Ct, Suite 6
Santa Clara
95054 CA
USA
+1 408 606 8189
Contact form

Perfect Cleave Mechanism (PCM) is a simple manual cleaving tool for cross-section of crystalline materials such as Si, GaN, GaAs, InPh, SiC and others.

PCM utilizes SELA’s proprietary Perfect Cleaving technologies to achieve fast cleaving of crystalline materials with perfect quality of cross-section.

The PCM had been presented to semiconductor market and delivered to customers in 2000 as a stand-alone solution for the sample preparation for SEM analysis and as a complementary tool for the initial sample preparation for the automatic microcleaving series of SELA - MC500, MC600 and MC600i systems SELA’s customers recognized great capability of the PCM and utilized it for wide variety of preparation requirements for past 15 years.

PCM is a compact tool and customers use it under magnified glasses and optical stereo microscopes to improve accuracy of cleaving.


System Highlights

  • Perfect quality of cross-section
  • High throughput
  • Improves and enhances SEM imaging
  • Compact size
  • Low cost of ownership

System Features

  • Perfect quality of cross-section for crystalline materials
  • Fast cleaving in less than a minute
  • Size of cleaved samples from full wafer and to single die 2x2mm
  • Manually controlled accuracy
  • Ease of use – – no previous experience required


For additional information of our products please, contact us

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