Solutions EnabLing nano Analysis
Language
microcleaving, cleaving, wafer cleaving, wafer cleave, MC600i

Contacts

SELA Ltd.
Headquarters
5 Hamada St
Southern High Tech Park
Yokneam Elite
2069204 Israel
+972 4 827 3988
Sela USA Inc.
473 Sapena Ct, Suite 6
Santa Clara
95054 CA
USA
+1 408 606 8189
Contact form

A dedicated, automated, timesaving and user-friendly system that enable TEM/STEM and SEM sample preparation for both cross section and plan viev in a wide range of application. Featuring a cryo-cooled, dry sawing process, the EM3 system prepares specimens of either crystalline or amourphous materials. The output sample is mounted onto a compatible TEM mount that allows rework.

  • Applicable for site-specific and general area
  • Enables multiple reworks of TEM specimen
  • Interfaces with broad and focused ion milling
  • Increases overali throughput
  • Improves yield analysis
  • Improves characterization
  • Low cost of ownership