SELA, a provider of cutting-edge engineering and failure analysis tools for the semiconductor industry, is introducing the Xact, the first TEM sample preparation system using the disruptive new AIM^TM

technology, delivering significantly reduced turnaround times and enhanced productivity. AIM^TM, SELA's unique Adaptive Ion Milling

technology, is superior to the traditional Focused Ion Beam technology (FIB). AIM^TM can reduce sample widths to below 50

nanometers over a large area with high precision, artifact free (wedge-like) quality, and higher throughput.

SELA’s newest system, Xact, introduces a twin-beam combination uniquely configured for more precise end-point detection and artifact-free sample clarity. The Xact joins SELA's SEM-oriented Microcleaving solution to set the standard for high-quality, automated engineering and failure analysis EM sample preparation.

The Xact and SELA’s latest pre-preparation standalone system – the EM3 – offers a comprehensive and cost effective solution for TEM and STEM sample preparation. The division of functions, pre-prep and final prep, between two standalone and optimized tools enables parallel processing for the highest total productivity. It also results in a low cost per sample and, more importantly, a low cost per successful sample given the success rate of preparation resulting from enhanced quality, large area and end-point detection.