The MC600 system achieves fully automatic, reliable and rapid cross-sectioning of whole and partial wafers. Dedicated software enables automatic mapping and navigating to targets, and features automatic off-loading for immediate inspection. These features, together with high throughput (9 min/sample), high accuracy (less than 0.5 micron), and the excellent quality of the cross-sections produced, significantly reduce the diagnostic cycle for both failure analysis and process monitoring


Features:

• Fully automated and programmable process
• Minimal operator involvement
• Short cycle time (9 min/sample)
• Single cleave option
• Small wafer segment capability
• High yield at best quality
• Cryo-cooling mechanism (LN2)
• Automatic sequencing, processing and handling

Benefits:

• Increase Overall Throughput
• Improves Yield Analysis
• Improves Characterization
• Improves and enhances SEM & FIB utilization
• Low cost of ownership