SELA Publications
- Cutting defects-process monitoring and control
- Adopting low-voltage STEM and automated sample prep to perform IC failure analysis
- 03.2002 - New material cross section
- 05.2001 - Site-specific, SEM semiconductor sample production...0.5 micron accuracy
- 10.2000 - Low-k thin films analyzed using automated SEM sample preparatcion
- 10.1999 - Microcleaving system helps ease FA sample prep bottleneck at Motorola
- Summer 1999 - FEI FIB and SELA Microcleaving Provide Fast, Accurate Cross Sections
