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There are multiple requirements to produce fast perfect cleaving quality cross-section of crystalline materials. SELA delivered perfect cleave technology to semiconductor customers as from 2000 utilized in Perfect Cleave Mechanism (PCM) as complementary tool for automatic microcleaving systems. Hundreds of PCM units are successfully using by most of semiconductor manufacturers. As from 2014 perfect cleave capability may be your choice for sample preparation by fast perfect cleaving. Contact one of SELA’s representative for details and demo.